Home / News / Industry News / Problem Solving In Installation Of Led Outdoor Lighting

    LED outdoor lighting has gradually approached the fields of commercial lighting, home lighting, and outdoor lighting. Due to the complex working environment of LED outdoor lighting fixtures, it is affected by natural conditions such as temperature, ultraviolet rays, humidity, rain on rainy days, sand and dust, and chemical gases. Over time, it will lead to serious problems of LED light decay. Therefore, attention should be paid to the installation and appearance.

    At present, most domestically produced LED lamps (mainly street lamps) are assembled with 1W LEDs in series and parallel. This method has higher thermal resistance than products with advanced packaging technology, but it is not easy to create high-quality lamps. Or use 30W, 50W, or even larger modules for assembly to achieve the required power. The packaging materials of these LEDs are encapsulated with epoxy resin and silicone. The difference between the two is that the epoxy resin encapsulation has poor temperature resistance and is easy to age over time. Silicone packaging has better temperature resistance, so you should pay attention to the selection when using it.

    It is better to use a multi-chip package with a heat sink as a whole, or use an aluminum substrate multi-chip package and then connect it to the heat sink through a phase change material or heat-dissipating silicone grease. The thermal resistance of the product is higher than that of the product assembled with LED devices. At least one or two hot suns are more conducive to heat dissipation. For lamps using LED modules, the module substrate is generally a copper substrate. The connection between it and the external radiator should use a good phase change material or a good heat dissipation silicone grease to ensure that the heat on the copper substrate can be transferred to the external radiator in time. If it is not handled properly, it is easy to accumulate heat and cause the temperature of the module chip to rise too high, which affects the normal operation of the led chip.